Industry-standard manufacturing specifications modeled after international fab houses (JLCPCB standard), engineered domestically in Bengaluru with 100% Flying Probe Electrical Testing.
| Parameter | Standard Capability | Advanced / Custom |
|---|---|---|
| Layer Count | 1 Layer (Single-Sided FR4) | 2 Layers (Double-Sided FR4) |
| Base Material | FR-4 Standard (Tg 130 - 140°C) | High-Tg FR-4 (Tg 170°C), Aluminum Core |
| Board Dimensions | Min: 10mm × 10mm • Max: 500mm × 500mm | Panelized V-Scoring / Tab Routing |
| Board Thickness | 0.6, 0.8, 1.0, 1.2, 1.6, 2.0 mm | 0.4mm, 2.4mm, 3.0mm |
| Board Outline Tolerance | ± 0.15 mm (CNC Routing) | ± 0.10 mm (Precision Die Punch) |
| Parameter | 1 oz (35 μm) Copper | 2 oz (70 μm) Copper |
|---|---|---|
| Min Trace Width (Track) | 3.5 mil (0.09 mm) | 5.0 mil (0.127 mm) |
| Min Trace Clearance (Spacing) | 3.5 mil (0.09 mm) | 5.0 mil (0.127 mm) |
| Copper to Board Edge | 0.25 mm (10 mil) for routed edge | 0.40 mm for V-Scored edges |
| Impedance Control | Standard ± 10% (50Ω Single / 90-100Ω Diff) | Precision ± 7% on request |
| Parameter | Standard Capability | Notes / Guidelines |
|---|---|---|
| Min CNC Drill Size (Hole) | 0.20 mm (8 mil) | Finished hole dia ≥ 0.15 mm |
| Max CNC Drill Size | 6.30 mm | Larger cutouts done via CNC milling router |
| Min Via Annular Ring | 0.13 mm (5 mil) | Pad size = Drill dia + 0.25 mm |
| PTH Hole Diameter Tolerance | ± 0.05 mm (± 2 mil) | Electroplated copper barrel ≥ 20 μm |
| NPTH Hole Diameter Tolerance | ± 0.05 mm | Non-plated tooling & mounting holes |
| Hole to Hole Clearance | 0.25 mm (10 mil) edge-to-edge | Prevents drill breakout during CNC drilling |
| Parameter | Standard Capability | Color Options |
|---|---|---|
| Solder Mask Colors | Liquid Photoimageable (LPI) Solder Mask | Green, Matte Black, Blue, Red, Yellow, White |
| Min Solder Mask Dam | 0.08 mm (3.15 mil) for Green Mask | 0.10 mm (4 mil) for other colors |
| Solder Mask Expansion | 0.05 mm (2 mil) per side | 1:1 ratio acceptable with CAM expansion |
| Silkscreen Legend | Min text height: 0.8 mm (32 mil) • Min stroke: 0.15 mm (6 mil) | High-contrast White (or Black on White mask) |
| Finish / Test | Description & Shelf Life | RoHS / Compliance |
|---|---|---|
| Lead-Free HASL | Tin-Silver-Copper hot air solder leveling. Shelf life: 12 months. | 100% RoHS Compliant |
| HASL with Lead | Sn63Pb37 traditional alloy. Ideal for hobbyist hand soldering. | Contains Lead (Non-RoHS) |
| ENIG (Immersion Gold) | Electroless Nickel (3-5 μm) with Flash Gold (1-2 μ"). Ultra-flat pads for BGA, fine-pitch QFN. | 100% RoHS Compliant |
| 100% Flying Probe E-Test | Full netlist electrical continuity and isolation testing for every board. | Zero open circuits, zero shorts guaranteed |
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